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1) Modüler Panel Bilgisayarlar

GM-1100

Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors

  • Intel® 14/13/12th Gen Core™ i9/i7/i5/i3 Processors (max 65 W TDP)
  • Supports 1x MXM 3.1 Type A/B form factor GPU module expansion.
  • 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Type C Connector
  • 1x M.2 Key M Type 2280 Socket for PCIe Gen4x4 NVMe Storage
  • 1x M.2 Key E Type 2230 Socket for Wireless/Intel CNVi Module Expansion
  • 1 x M.2 Key B Type 3052/3042 Socket for 5G/Storage/Add-on Card Expansion
  • 2 x M.2 Key B Type 2242 Socket for Storage/Add-on Card Expansion
  • Optional CMI & CFM Modules for I/O Expansion & Power Ignition Sensing Function
  • Wide operating temperature -40°C to 70°C
Destekleyen İşlemciler
  • GM-1100
  • GM-1100
  • GM-1100
  • GM-1100
  • GM-1100
  • GM-1100
  • GM-1100
1) Modüler Panel Bilgisayarlar

GM-1100

The GM-1100 is a compact and rugged embedded MXM GPU computer for high-performance computing needs. It combines powerful computing and graphics processing capabilities with highly flexible expansion, making it ideal for edge AI applications with limited installation space.

Available Model
Model No. Description
GM-1100-R10 14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket
Package Checklist
  • GM-1100 GPU Computer x 1
  • CPU Heatsink Pack x1
  • Screw Pack x1
  • Power Terminal Block Connector x 2
  • Remote Function Terminal Block Connector x1
  • External Fan Terminal Block Connector x2
  • Wall Mounting Kit x1
  • M.2 Key B Type 3052 to 3042 Adapter Bracket x1
Optional MXM GPU Module & Accessories
Model No. Description
MXM-A4500-R10 NVIDIA Embedded RTX A4500 MXM Type A, 16G, 80W Kit with Heatsink and Thermal Pad
MXM-A2000-R10 NVIDIA Embedded RTX A2000 MXM Type A, 8G, 60W Kit with Heatsink and Thermal Pad
MXM-A1000-R10 NVIDIA Embedded RTX A1000 MXM Type A, 4G, 60W Kit with Heatsink and Thermal Pad
MXM-A500-R10 NVIDIA Embedded RTX A500 MXM Type A, 4G, 40W Kit with Heatsink and Thermal Pad
MXM-RTX3000-R10 NVIDIA Quadro Embedded RTX3000 MXM Kit with Heatsink and Thermal Pad
MXM-T1000-R10 NVIDIA Quadro Embedded T1000 MXM Kit with Heatsink and Thermal Pad
MXM-HSKA-01 MXM Type A Heatsink Kit for MXM-A500
MXM-HSKA-02 MXM Type A Heatsink Kit for MXM-A1000 & MXM-A2000
MXM-HSKA-03 MXM Type A Heatsink Kit for MXM-T1000
MXM-HSKB-01 MXM Type B Heatsink Kit for MXM-A4500
MXM-HSKB-02 MXM Type B Heatsink Kit for MXM-RTX3000

Ürün Özellikleri

Model Name GM-1100
System Processor 14th Generation Intel® Raptor Lake-S Refresh Series CPU (Coming Soon)
13th Generation Intel® Raptor Lake-S Series CPU:
• Intel® Core™ i9-13900E 24 Cores Up to 5.2 Ghz, TDP 65W
• Intel® Core™ i7-13700E 16 Cores Up to 5.1 Ghz, TDP 65W
• Intel® Core™ i5-13500E 14 Cores Up to 4.6 Ghz, TDP 65W
• Intel® Core™ i5-13400E 10 Cores Up to 4.6 Ghz, TDP 65W
• Intel® Core™ i3-13100E 4 Cores Up to 4.4 Ghz, TDP 65W
• Intel® Core™ i9-13900TE 24 Cores Up to 5.0 Ghz, TDP 35W
• Intel® Core™ i7-13700TE 16 Cores Up to 4.8 Ghz, TDP 35W
• Intel® Core™ i5-13500TE 14 Cores Up to 4.5 Ghz, TDP 35W
• Intel® Core™ i3-13100TE 4 Cores Up to 4.1 Ghz, TDP 35W
12th Generation Intel® Alder Lake-S Series CPU:
• Intel® Core™ i9-12900E 16 Cores Up to 5.0 GHz, TDP 65W
• Intel® Core™ i7-12700E 12 Cores Up to 4.8 GHz, TDP 65W
• Intel® Core™ i5-12500E 6 Cores Up to 4.5 GHz, TDP 65W
• Intel® Core™ i3-12100E 4 Cores Up to 4.2 GHz, TDP 60W
• Intel® Core™ i9-12900TE 16 Cores Up to 4.8 GHz, TDP 35W
• Intel® Core™ i7-12700TE 12 Cores Up to 4.7 GHz, TDP 35W
• Intel® Core™ i5-12500TE 6 Cores Up to 4.3 GHz, TDP 35W
• Intel® Core™ i3-12100TE 4 Cores Up to 4.0 GHz, TDP 35W
• Intel® Pentium® G7400E 2 Cores Up to 3.6 GHz, TDP 46W
• Intel® Pentium® G7400TE 2 Cores Up to 3.0 GHz, TDP 35W
• Intel® Celeron® G6900E 2 Cores Up to 3.0 GHz, TDP 46W
• Intel® Celeron® G6900TE 2 Cores Up to 2.4 GHz, TDP 35W
Chipset • Intel R680E Chipset
Memory • 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB
BIOS • AMI BIOS
Graphics Graphics Engine • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5
• Integrated Intel® UHD Graphics 730: Core™ i3
• Integrated Intel® UHD Graphics 710: Pentium®/Celeron®
Maximum Display Output • Supports Triple Independent Display
DP • 1x DisplayPort Connector (4096 x 2304@60Hz)
*Verified maximum resolution: 3840×2160@ 60Hz
HDMI • 1x HDMI Connector (4096 x 2160@30Hz)
*Verified maximum resolution: 3840×2160@ 30Hz
VGA • 1x VGA Connector (1920 x 1200 @60Hz)
Audio Audio Codec • Realtek® ALC888, High Definition Audio
Line-out • 1x Line-out, Phone Jack 3.5mm
Mic-in • 1x Mic-in, Phone Jack 3.5mm
I/O LAN • 1x 2.5GbE LAN, RJ45
–  Intel® I225
• 1x 1GbE LAN, RJ45
–  Intel® I219
COM • 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9
USB • 1x 20Gbps USB3.2 Gen2 x2, Type C
• 3x 10Gbps USB3.2 Gen2 x1, Type A
• 4x 5Gbps USB3.2 Gen1 x1, Type A
Storage SSD/HDD • 2x 2.5” Front Accessible SATA HDD/SSD Drive Bay ( SATA3.0 )
(up to 15mm in Height)
M.2 SSD • 1x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0)
• 1x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3×2 NVMe SSD or SATA SSD (SATA3.0)
• 2x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4×2 NVMe SSD or SATA SSD (SATA3.0)
RAID • Support RAID 0/1/5/10
Expansion MXM Socket • 1x MXM Carrier Board Socket for MXM GPU Module Expansion
M.2 E Key Socket • 1x M.2 Key E Type 2230 Socket (PCIe Gen 3×2 / USB2.0), Support Wireless/Intel CNVi Module Expansion
M.2 B Key Socket • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3×2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion
• 2x M.2 Key B Type 2242 Socket (PCIe Gen 4×2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion
SIM Socket • 2x SIM Socket
CMI (Combined Multiple I/O) Interface • 1x High Speed CMI Interface for optional CMI Module Expansion
• 1x Low Speed CMI Interface for optional CMI Module Expansion
CFM (Control Function Module) Interface • 1x CFM IGN Interface for optional CFM-IGN Module Expansion
Other Function External FAN Connector • 2x External FAN Connector, 4-pin Terminal Block
(Support Smart Fan by BIOS)
Power Ignition Sensing • Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V
(With Optional CFM Module)
Clear CMOS Switch • 1x Clear CMOS Switch
Reset Button • 1x Reset Button
Instant Reboot • Support 0.2sec Instant Reboot Technology
Watchdog Timer • Software Programmable Supports 256 Levels System Reset
Antenna Holes • 2x Antenna Holes
Status LED Indicator • HDD LED、GPIO LED、IGN LED、GPU LED、Ethernet LED
Power Power Button • 1x ATX Power On/Off Button
Power Mode Switch • 1x AT/ATX Mode Switch
Power Input • 9-48 VDC, Single Power Source
Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A
• Power input voltage from 9V to 23V must use dual power connectors,
power input voltage from 24V to 48V can use single power connector
Remote Power On/Off • 1x Remote Power On/Off, 2-pin Terminal Block
Max. Power Consumption • 35W CPU: 187.51W
• 65W CPU: 258.96W
– Test conducted with CPU, 1x RAM, and 1x storage
– 100% load during burn-in testing.
Physical Dimension ( W x D x H ) • 260 x 200 x 85 mm
Weight Information • 4.73 kg
Mechanical Construction • Extruded Aluminum with Heavy Duty Metal
Mounting • Wall / Side / DIN-RAIL / VESA Mount
Physical Design • Fanless Design
• Cableless Design
• Jumper-less Design
• Unibody Design
Reliability & Protection Reverse Power Input Protection • Yes
Over Voltage Protection • Protection Range: 51~58V
• Protection Type: shut down operating voltage, re-power on at the preset level to recover
Over Current Protection • 30A
CMOS Battery Backup • SuperCap Integrated for CMOS Battery Maintenance-free Operation
MTBF • 313,541 Hours
–  Database: Telcordia SR-332 Issue3, Method 1, Case 3
Operating System Windows • Windows®11, Windows®10
Linux • Ubuntu Desktop 22.04 LTS
Environment Operating Temperature • 35W TDP Processor: -40°C to 70°C
• 65W TDP Processor with external FAN: (TBC)
* PassMark BurnInTest: 100% CPU, 2D/3D Graphics   (without thermal throttling)
* For GM-1100 + MXM GPU Module operating temperature, please refer to the last page – Operating Temperature Matrix Table for more information (TBC)
* With extended temperature peripherals; Ambient with air flow
* According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14
Storage Temperature • -40°C to 70°C
Relative Humidity • 95%RH @ 70°C (non-Condensing)
Shock • MIL-STD-810H
Vibration • MIL-STD-810H
EMC • CE, UKCA, FCC, ICES-003 Class A
• EN 50155 (EN 50121-3-2 Only)
• E-mark (Pending)
EMI • CISPR 32 Conducted & Radiated: Class A
• EN/BS EN 50121-3-2 Conducted & Radiated: Class A
• EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A
• EN/BS EN 61000-3-3 Voltage fluctuations & flicker
• FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A
EMS • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV
• EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m
• EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV
• EN/IEC 61000-4-5 Surges: AC Power: 2 kV
• EN/IEC 61000-4-6 CS: 10V
(**Compliant with the standard when utilizing shielded cable.)
• EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m
• EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz

Benzer Ürünlerimiz

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CV-112H / P1101

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CV-108 / P1100

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CV-W121/P1001E

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CV-119/P1001E

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CV-112H / P1001E

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CV-112H/P1001

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CV-112 / P1001

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CV-110 / P1001E

CV-110 / P1001E

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CV-110 / P1001

CV-110 / P1001

Intel® Atom™ E3845, SoC

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CV-108 / P1001E

CV-108 / P1001E

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CV-108 / P1001

CV-108 / P1001

Intel® Atom™ E3845, SoC

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